Hi everyone,
I’m looking for some specific technical details regarding the Hailo-8 M.2 AI Acceleration Module to ensure proper fitment and thermal management in a custom housing.
Specifically, I need documentation or a datasheet that covers:
- Mechanical Dimensions: Detailed layout of the module, including the exact placement of the Hailo-8 chip on the PCB.
- PCB Thickness: The standard thickness of the carrier board, including any manufacturing tolerances.
If there is a hardware design guide or a mechanical drawing (DXF/STEP) available for the M.2 form factor versions (Key A+E or M), I would greatly appreciate.