Mechanical Specifications for Hailo-8 M.2 Module

Hi everyone,

I’m looking for some specific technical details regarding the Hailo-8 M.2 AI Acceleration Module to ensure proper fitment and thermal management in a custom housing.

Specifically, I need documentation or a datasheet that covers:

  1. Mechanical Dimensions: Detailed layout of the module, including the exact placement of the Hailo-8 chip on the PCB.
  2. PCB Thickness: The standard thickness of the carrier board, including any manufacturing tolerances.

If there is a hardware design guide or a mechanical drawing (DXF/STEP) available for the M.2 form factor versions (Key A+E or M), I would greatly appreciate.

There are 3D models available in the Developer Zone under Documentation.

Developer Zone - Documentation

Select Hailo-8 - Hardware and type 3D in the Find a Document box.

There are two configurations of the Hailo-8 M.2 A+E module and therefore two 3D models.